Nano Tera Wiki: CMOSAIC : 3D Stacked Architectures with Interlayer Cooling

CMOSAIC : 3D Stacked Architectures with Interlayer Cooling

References about CMOSAIC:

15 March 2010: IBM News
26 Jan 2010: Le Temps (in french)
18 Jan 2010: Swiss Radio - Biosphere (in French) - An interview is also avalaible
16 Dec 2009: Gizmag.com
14 Dec 2009: TheRegister - British News Site
12 Dec 2009: NanotechWire.com
11 Dec 2009: AZoNano.com
11 Dec 2009: EPFL-Actualites
11 Dec 2009: HPC Wire
10 Dec 2009: EPFL-Embedded Systems Laboratory (ESL)
10 Dec 2009: MyScience - Swiss Portal for Science and Innovation

IBM, Participating Institution

Go To: IBM Research Integrated Cooling LAB

What is CMOSAIC

The CMOSAIC project is a genuine opportunity to contribute to the realization of arguably the most complicated system that mankind has ever assembled: a 3D stack of computer chips with a functionality per unit volume that nearly parallels the functional density of a human brain. CMOSAIC's aggressive goal is to provide the necessarily 3D integrated cooling system that is the key to compressing almost 1012 nanometer sized functional units (1 Tera) into one cubic centimeter with a 10 to 100 fold higher connectivity than otherwise possible. Even the most advanced air-cooling methods are inadequate for high performance 3D-IC systems where the main challenge is to remove the heat produced by multiple stacked dies in a 1-3 cm3 volume, each layer dissipating 100-150 W/cm2. State-of-the-art single phase liquid and two- phase cooling systems, using specifically designed microchannel arrangements, and employing coolants ranging from liquid water and two-phase environmentally friendly refrigerants to novel engineered nano-fluids offer significant advantages in addressing heat removal challenges leading to practical 3D systems. CMOSAIC aims at developing the engineering science base that will enable a new state of the art in high density electronics cooling.