EPFL/STI/IGM/LTCM 
Expert in microscale two-phase flow and heat transfer and modeling of micro-evaporators
John Thome
EPFL
CMOSAIC
3D Stacked Architectures with Interlayer Cooling
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EPFL/STI/IEL/ESL
Expert in thermal modeling of multiprocessor architectures and thermal management, hardware/software co-design methods
David Atienza
EPFL
EPFL/STI/IEL/LSM
Expert in chip design, intelligent detector, VLSI design, high-level specification and synthesis, sensors development
Yusuf Leblebici
EPFL
IBM Zürich
Expert in thermal packaging of high performance computers
Bruno Michel
IBM Zürich
ETHZ/D-MAVT/IET/LTNT
Expert in micro-scale liquid phase cooling, nanofluid heat transfer and heat transfer modeling
Dimos Poulikakos
ETHZ
ETHZ/DCHAB/ICB/FML
Expert in catalyst nanoparticles, nanomaterials and conception and characterization of nanofluids
Jan Wendelin Stark
ETHZ

Project Description

The project addresses interlayer cooling of 3D computer  chips, including water cooling, two-phase refrigerant cooling, development and perfection  of new micro-fabrication techniques  for TSVs and their connections, bonding  of stacked layers together, dynamic thermal modeling of 3D chips, and extensive experimental testing of2D and 3D cooling solutions and new thermal models. 

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Our researchers in the media

Notable publications

Soft iron/silicon composite tubes for magnetic peristaltic pumping: Frequency-dependent pressure and volume flow
R. Fuhrer, C.M.Schumacher, M. Zeltner, and Wendelin J. Stark
Advanced Functional Materials

Accelerating Thermal Simulations of 3D ICs with Liquid Cooling using Neural Networks
A. Vincenzi, A. Sridhar, M. Ruggiero and D. Atienza Alonso
22nd edition of Great lakes symposium on VLSI (GLSVLSI2012)

Development and characterization of custom-engineered and compacted nanoparticles as calibration materials for quantification using LA-ICP-MS
Daniel Tabersky, Norman A. Luechinger, Michael Rossier, Eric Reusser, Kathrin Hametner, Beat Aeschlimann, Daniel A. Frick, Samuel C. Halim, Jay Thompson, Leonid Danyushevskyd and Detlef Günther
Journal of Analytical Atomic Spectrometry

Synthesis of Trisubstituted Ureas by a Multistep Sequence Utilizing Recyclable Magnetic Reagents and Scavengers
Quirin M. Kainz, Martin Zeltner, Michael Rossier, Wendelin J. Stark, and Oliver Reiser
Chemistry : a European journal


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Posters from 2013


Intra chip stack fluidic cooling: the CMOSAIC demonstrator
Yassir Madhour, Michail Zervas, Brian P. D'Entremont, Thomas Brunschwiler, Gerd Schlottig, Bruno Michel, Yusuf Leblebici and John Richard Thome

Integrated Water Cooling of 3D Electronic Chips
Adrian Renfer, Fabio Alfieri, Manish K. Tiwari, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos

Superhydrophobic surfaces
Michael Rossier, Daniela Paunescu, Wendelin Jan Stark

EDA for CMOSAIC: a new generation of CAD tools for liquid-cooled 2D/3D ICs
Arvind Sridhar, Mohamed Sabry, Alessandro Vincenzi, David Atienza, Thomas Brunschwiler

Posters from 2012


Posters from 2011


Superhydrophobic surfaces
Michael Rossier, Jan Wendelin Stark

Integrated Single Phase Water Cooling of 3D Chips: Modeling and Experiments
Adrian Renfer, Fabio Alfieri, Manish Tiwari, Igor Zinovik, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos

Die-Level Through-Silicon-Via (TSV) Fabrication Platform
Yuksel Temiz, Michael Zervas, Carlotta Guiducci, Yusuf Leblebici

Wafer level TSV compatible to liquid cooling high performance CMOS
Michael Zervas, Yuksel Temiz, Yusuf Leblebici


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Project Photos