The project addresses interlayer cooling of 3D computer chips, including water cooling, two-phase refrigerant cooling, development and perfection of new micro-fabrication techniques for TSVs and their connections, bonding of stacked layers together, dynamic thermal modeling of 3D chips, and extensive experimental testing of2D and 3D cooling solutions and new thermal models.
3D ALE Finite Element Method for Two-Phase Flows with Phase Change G. Anjos, N. Mangiavacchi, N. Borhani, J.R. Thome Heat Transer Engineering, DOI:10.1080/01457632.2013.833407.
Two-phase heat transfer and high-speed visualization of refrigerant flows in 100 × 100 m2 silicon multi-microchannels S. Szczukiewicz, N. Borhani, J.R. Thome International Journal of Refrigeration, vol. 36, num. 2, p. 402-413, 2013.
Two-phase flow operational maps for multi-microchannel evaporators S. Szczukiewicz, N. Borhani, J.R. Thome International Journal of Heat and Fluid Flow, vol. 42, p. 176-189, 2013.
Fine-resolution two-phase flow heat transfer coefficient measurements of refrigerants in multi-microchannel evaporators S. Szczukiewicz, N. Borhani, J.R. Thome International Journal of Heat and Mass Transfer, vol. 67, p. 913-929, 2013.